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- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
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DIN EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
DIN EN 60191-6-22
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
DIN EN IEC 60204-11
Safety of machinery - Electrical equipment of machines - Part 11: Requirements for equipment for voltages above 1 000 V AC or 1 500 V DC and not exceeding 36 kV (IEC 60204-11:2018); German version EN IEC 60204-11:2019
DIN EN 60195
Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016
DIN EN 60196
IEC-Normfrequenzen (IEC 60196:2009); Deutsche Fassung EN 60196:2009
IEC standard frequencies (IEC 60196:2009); German version EN 60196:2009
DIN EN 60204-1
Safety of machinery - Electrical equipment of machines - Part 1: General requirements (IEC 60204-1:2016, modified); German version EN 60204-1:2018
DIN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
DIN EN 60192
Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001
DIN EN 60191-6-18
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
DIN EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010