News
- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
- 2018-09-07 Cooperation, the key to the future
- 2016-11-15 Sino-German City-to-City Standardization Cooperation Seminar
Links
- BAM - Federal Institute for Materials Research and Testing
- DIN Media - DIN Media GmbH
- BMWK - Federal Ministry for Economic Affairs and Climate Action
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Search
DIN EN 60196
IEC-Normfrequenzen (IEC 60196:2009); Deutsche Fassung EN 60196:2009
IEC standard frequencies (IEC 60196:2009); German version EN 60196:2009
DIN EN 60195
Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016
DIN EN 60192
Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001
DIN EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
DIN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
DIN EN 60191-6-6
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
DIN EN 60191-6-18
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
DIN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
DIN EN 60191-6-16
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
DIN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016