News
- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
- 2018-09-07 Cooperation, the key to the future
- 2016-11-15 Sino-German City-to-City Standardization Cooperation Seminar
Links
- BAM - Federal Institute for Materials Research and Testing
- DIN Media - DIN Media GmbH
- BMWK - Federal Ministry for Economic Affairs and Climate Action
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
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GB/T 42434-2023
General specification for aerospace variable delivery,pressure compensated, hydraulic pumps
GB/T 20818.16-2023
工业过程测量和控制 过程设备目录中的数据结构和元素 第16部分:密度测量设备电子数据交换用属性列表（LOPs）
Industrial-process measurement and control—Data structures and elements in process equipment catalogues—Part 16: Lists of properties (LOPs) for density measuring equipment for electronic data exchange
GB/T 6683.3-2023
石油及相关产品 测量方法与结果精密度 第3部分:试验方法已发布精密度数据的监测和验证
Petroleum and related products—Precision of measurement methods and results—Part 3: Monitoring and verification of published precision data in relation to methods of test
GB/T 43584.2-2023
Biotechnology—Massively parallel sequencing—Part 2: Quality evaluation of sequencing data
GB/T 43574-2023
化学纤维 重金属含量的测定 电感耦合等离子体发射光谱法和电感耦合等离子体质谱法
Man-made fibers—Determination of heavy metal content—Inductively coupled plasma optical emission spectrometry(ICP-OES) and inductively coupled plasma mass spectrometry(ICP-MS)
GB/T 42709.7-2023
半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
GB/T 26237.14-2023
Information technology — Biometric data interchange formats— Part 14:DNA data
GB/T 15092.3-2023
Switches for appliances—Part 2-5: Particular requirements for change-over selectors
GB/T 15879.604-2023
半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)