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- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
- 2018-09-07 Cooperation, the key to the future
- 2016-11-15 Sino-German City-to-City Standardization Cooperation Seminar
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DIN EN IEC 62052-11
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment (IEC 62052-11:2020, modified); German version EN IEC 62052-11:2021 + A11:2022
DIN EN IEC 62052-11/A12
Electricity metering equipment - General requirements, tests and test conditions - Part 11: Metering equipment; German version EN IEC 62052-11:2021/A12:2024
DIN EN 62052-21
Electricity metering equipment (AC) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment (IEC 62052-21:2004 + A1:2016); German version EN 62052-21:2004 + A1:2017
DIN EN IEC 62052-31
Electricity metering equipment - General requirements, tests and test conditions - Part 31: Product safety requirements and tests (IEC 62052-31:2024); German version EN IEC 62052-31:2024
DIN EN IEC 62052-41
Electricity metering equipment - General requirements, tests and test conditions - Part 41: Energy registration methods and requirements for multi-energy and multi-rate meters (IEC 62052-41:2022); German version EN IEC 62052-41:2022
DIN EN 62047-21
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
DIN EN 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
DIN EN 62047-25
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
DIN EN 62047-26
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
DIN EN 62047-16
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015





