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- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
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- 2016-11-15 Sino-German City-to-City Standardization Cooperation Seminar
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- BAM - Federal Institute for Materials Research and Testing
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- DIN - Deutsches Institut für Normung
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DIN EN 60749-44
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
DIN EN IEC 60751
Industrial platinum resistance thermometers and platinum temperature sensors (IEC 60751:2022); German version EN IEC 60751:2022
DIN EN 60754-1
Test on gases evolved during combustion of materials from cables - Part 1: Determination of the halogen acid gas content (IEC 60754-1:2011 + corrigendum Nov. 2013 + A1:2019); German version EN 60754-1:2014 + A1:2020
DIN EN 60756
Non-broadcast video recorders; time base stability (IEC 60756:1991); German version EN 60756:1993
DIN EN IEC 60757
Code for designation of colours (IEC 60757:2021); German version EN IEC 60757:2021
DIN EN IEC 60754-3
Test on gases evolved during combustion of materials from cables - Part 3: Measurement of low level of halogen content by ion chromatography (IEC 60754-3:2018); German version EN IEC 60754-3:2019
DIN EN 60749-38
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN 60749-33
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
DIN EN 60749-34
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 60749-34:2010); German version EN 60749-34:2010
DIN EN 60749-35
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006); German version EN 60749-35:2006