News
- 2019-05-24 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction"
- 2018-09-07 Cooperation, the key to the future
- 2016-11-15 Sino-German City-to-City Standardization Cooperation Seminar
Links
- BAM - Federal Institute for Materials Research and Testing
- DIN Media - DIN Media GmbH
- BMWK - Federal Ministry for Economic Affairs and Climate Action
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Search
DIN EN 61194
Characteristic parameters of stand-alone photovoltaic(PV) systems (IEC 61194:1992, modified); German version EN 61194:1995
DIN EN 61193-1
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
DIN EN 61193-2
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007
DIN EN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
DIN EN IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
DIN EN 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
DIN EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
DIN EN 61189-6
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
DIN EN 61191-2 Berichtigung 1
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
DIN EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017